Proposal background

MEMS refers to a process that combines microelectronics and micromachining to produce a variety of sensors, actuators, actuators, and microsystems with excellent performance, low cost, and miniaturization. MEMS has entered many aspects of our lives, including automotive electronics, consumer electronics, and medical care. For example, in the field of consumer electronics, Apple Inc. imaginatively used MEMS accelerometers to support the automatic switching of the horizontal and vertical images of the iPhone display, and achieved great success, thereby stimulating the use of smartphones to detect motion in MEMS sensor applications. Surge.

China has also made considerable progress in the field of MEMS design and manufacturing. The research of Peking University, Tsinghua University, Shanghai Microsystems Institute, 13 CLP, 49 CLP, 55 CLP, Southeast University and Shanghai Jiaotong University has been at the leading level in China and even internationally. The "method for testing the shear strength and tensile strength of micro-bonding zones in silicon-based MEMS manufacturing technology" introduced in this article is based on the research results of Peking University and proposes an international standard.

2. Introduction to international standard proposals

2.1 Overview

MEMS research content can generally be summarized as the following three basic aspects:

(1) Theoretical basis

At the current scale that MEMS can reach, the basic physical laws of the macroscopic world still play a role, but due to the effect of size reduction, many physical phenomena are very different from the macroscopic world, so many original theoretical foundations will change. For example, the size effect of force, the surface effect of microstructure, and the microscopic friction mechanism, it is necessary to conduct in-depth research on micro-kinetics, micro-fluid mechanics, micro-thermodynamics, micro-tribology, micro-optics, and micro-structurals. Although the research in this area is highly regarded, it is more difficult and often requires multidisciplinary scholars to conduct basic research.

(2) Technical basic research

It mainly includes basic research on micro-mechanical design, micro-mechanical materials, micro-fabrication, micro-assembly and packaging, integrated technology, and micro-measurement.

(3) Applied research of micro-mechanics in various disciplines

Due to the special structure of MEMS products, the control of materials and key processes in its production process has always been a hot spot in the world. As the most active MEMS standardization organization in the world, IEC/TC47/SC47F (MEMS sub-committee) has been in recent years. Formulate a series of standards, such as IEC 62047-17 "Microelectronic devices for semiconductor devices - Part 17: Methods for measuring the mechanical properties of expanded plastics", IEC 62047-18 "Microelectronic devices for semiconductor devices - Part 18: Thin film materials "Bending test method" and other important micro-structure test methods meet the requirements for the micro-structure evaluation in the MEMS manufacturing process.

With the maturation of test methods, MEMS international standards are also moving towards the direction of product specifications from test method standards. For example, MEMS gyroscopes are used in automobiles to control automobiles. In recent years, MEMS gyroscope chips have been widely used in terminal equipment such as mobile phones, and IEC/TC47/SC47F has also formulated IEC 62047-20 “Microelectronic Devices for Semiconductor Devices. Micromachined Devices Part 20: Gyro” standard to standardize the production and testing of MEMS gyroscope chips for mobile phones; and IEC 62047-5 “Microelectronics Micro Devices for Semiconductor Devices Part 5: RF MEMS Switches” to standardize communication devices Use RF MEMS switch parameter requirements and test methods. It is expected that in the near future, the IEC will formulate more and more MEMS product specifications to meet the growing market demand for MEMS products in the world.

2.2 The significance of the standard

In early 2013, Prof. Zhang Dacheng of Peking University, on behalf of China, proposed IEC/TC47/SC47F, “Shear and Tensile Strength Detection Methods for Silicon-based MEMS Manufacturing Microbonding Zones,” and was approved. This standard is China's first standard to be established in IEC/TC47/SC47F. Its proposal also has very important significance for MEMS standardization:

(1) Silicon-based MEMS Manufacturing Technology

MEMS manufacturing technology is mainly divided into three categories:

● Based on X-ray depth lithography, micro-electroforming, micro-casting LIGA technology, represented by Germany;

● Precision machining technology, represented by Japan;

● Silicon-based MEMS manufacturing technology developed on the basis of integrated circuit technology and materials originated in the United States. Silicon-based MEMS manufacturing technology follows the technology and materials of semiconductor technology, and has been effectively expanded in the field of micro-machining. It has the advantages of mass production, low cost, and easy integration with circuits, becoming the mainstream of MEMS manufacturing technology.

Due to the wide variety of MEMS devices and the fact that most of them have a movable structure, their design, materials, manufacturing, and other aspects are very different from those of semiconductor technology. This has also caused great dispersivity in the direction and content of MEMS research. Under this circumstance, the core of MEMS standardization is to develop one or more process modules with strong applicability, stability, and high yield, and establish corresponding design criteria on this basis. Therefore, the silicon-based MEMS manufacturing technology standard represents the current international mainstream direction, and is also the core content of MEMS standardization, and has extremely important significance.

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