Applied materials introduce 45nm photomask etching technology equipment
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Tom St. Dennis, senior vice president of Applied Materials, General Manager of the Etching, Cleaning, Front and Ion Implantation Division, said: "The outstanding performance of the Tetra III system in advanced binary mask and phase shift mask applications is to help customers. The key to achieving 45nm and smaller technology node mask products. As the industry develops some potential next-generation lithography solutions, related applications are also emerging at an unprecedented rate. The TetraIII system is capable of all lithography applications in a variety of Etching is done on different photomask materials."
The ultra-clean and technologically extended platform of the AppliedCenturaTetraIII system allows customers to achieve the highest current output on the most advanced masks.